Selective epitaxy vertical integrated circuit components and methods

ABSTRACT

Integrated circuit components are described that are formed using selective epitaxy such that the integrated circuit components, such as transistors, are vertically oriented. These structures have regions that are doped in situ during selective epitaxial growth of the component body. These components are grown directly in electrical communication lines. Moreover, these components are adapted for use in memory devices and are believed to not require the use of shallow trench isolation.

This application is a Divisional of U.S. application Ser. No. 10/765,301filed Jan. 27, 2004, which is incorporated herein by reference.

TECHNICAL FIELD

The present invention relates generally to vertical integrated circuits,and in particular to apparatus and methods for vertical transistors ormemory cells.

BACKGROUND

This section is intended to introduce the reader to various aspects ofart that may be related to various aspects of the present invention,which are described and/or claimed below. This discussion is believed tobe helpful in providing the reader with background information tofacilitate a better understanding of the various aspects of the presentinvention. Accordingly, it should be understood that these statementsare to be read in this light, and not as admissions of prior art.

Semiconductor memory devices, such as dynamic random access memory(DRAM) devices, are widely used for storing data in systems such ascomputer systems.

A DRAM memory cell typically includes an access device such as a fieldeffect transistor (FET) coupled to a storage device such as a capacitor.The access device allows the transfer of charges to and from the storagecapacitor thereby facilitating read and write operations in the memorydevice. The memory cells are typically arranged in a number of rows andcolumns to provide a memory array.

The present invention relates to semiconductor devices, and moreparticularly to a vertically oriented field effect transistor (FET)which includes a dog-bone structure. The present invention also relatesto a method of fabricating the aforementioned vertically oriented FET. Achallenge of very large scale integration (VLSI) has been theintegration of an ever-increasing number of metal oxide semiconductorfield effect transistor (MOSFET) devices with high yield andreliability. This was achieved mainly in the prior art by scaling downthe MOSFET channel length without excessive short-channel effects. Withthe constantly increasing demand for higher data storage capacity,memory arrays are becoming more dense. Memory density is typicallylimited by current processing technologies used for fabrication of thememory arrays. One technique for providing higher density memory arraysis to incorporate vertical technology in fabricating the accesstransistors. Among the concerns in fabricating memory devices is toprovide memory cells with minimal leakage to prevent the loss of storagecell data. Further, alpha-particle induced soft errors which alter thedata stored in the memory cells should also be considered, andsimplification in fabrication techniques may also be desirable.

For the reasons stated above, for other reasons stated below, and forother reasons which will become apparent to those skilled in the artupon reading and understanding the present specification, there is aneed in the art for an improved electronic component package and methodsof packaging electronic components.

SUMMARY

An embodiment of the present invention is directed to forming verticalintegrated circuit structures using selective epitaxy and the resultinginventive structures. In an embodiment, a memory cell includes avertical access device having a selective epitaxy mesa and an electricalenergy storage device on the selective epitaxy mesa. The selectiveepitaxy mesa includes a bottom source/drain and a top source/drain, andwherein the selective epitaxy mesa further includes a conductive bodyseparating the bottom source/drain from the top source/drain. The topsource/drain is vertically spaced from the substrate. The bottomsource/drain is an in situ doped region in an embodiment. The topsource/drain is an in situ doped region in an embodiment. In anembodiment, the bottom source/drain includes a semi-annular ring arounda bottom portion of the selective epitaxy mesa. In an embodiment, theheight of the bottom source/drain is about equal to a height of thesignal line to which it is attached. In an embodiment, the height of thebottom source/drain is less than the height of the signal line. Oneexample of a signal line includes a buried digit line. Another exampleof a signal line is a wordline. The structures of an embodiment areformed without shallow trench isolation. The selective epitaxy used tofabricate the vertical body of the mesa is adapted for use with asilicon substrate to selectively form a silicon mesa in an embodiment.The use of selective epitaxy further allows the in situ doping of themesa during fabrication to form the source and drain regions. In anembodiment a source/drain region extends around an outer periphery ofthe selective epitaxy mesa. The electrical communication lines canextend completely or partly around the source/drain region. The gates ofthe access device at least partially surround the insulator such thatthe gate effects electrical conductivity of the body from more than oneangle. In an embodiment, an insulator completely surrounds the body ofthe mesa with the gate completely overlies the insulator. The portion ofthe mesa body beneath the gate and intermediate the top and bottomsource/drain regions forms the channel of a transistor.

The present invention includes embodiments directed to the fabricationof integrated circuit devices having vertical structures formed byselective epitaxy. An embodiment includes patterning a buried conductorline on a substrate, forming recess through the buried conductor line tothe substrate, forming, through selective epitaxy, a vertical mesa inthe recess. In an embodiment, a bottom source/drain region is dopedwhile forming the mesa. In an embodiment, a top source/drain region isdoped while forming the mesa. Further processing steps form a gate oxideon the mesa and form a gate on the gate oxide at least partiallysurrounding the mesa. Embodiments of the present invention includeforming the structures described herein. The buried conductor line isformed so that it completely surrounds and the bottom source/drain. Theselective epitaxy of an embodiment includes using chemical vapordeposition processes that are adapted for selective epitaxy. Anembodiment of the present invention further uses homoepitaxy of silicon.The selective epitaxy, in an embodiment, includes exposing a siliconsurface to a gas mixture including H₂ and SiH₂Cl₂ in a temperature rangebetween 600-800 degrees C. In an embodiment, the selective epitaxy is amolecular beam epitaxy.

Embodiments of the present invention also includes substrates, wafers,integrated circuit packages, electrical devices, memory devices, memoryunits, memory modules, electrical systems, computers, which arefabricated according to the present invention.

These and other embodiments, aspects, advantages, and features of thepresent invention will be set forth in part in the description whichfollows, and in part will become apparent to those skilled in the art byreference to the following description of the invention and referenceddrawings or by practice of the invention. The aspects, advantages, andfeatures of the invention are realized and attained by means of theinstrumentalities, procedures, and combinations particularly pointed outin the appended claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a partial schematic illustration of an integratedcircuit incorporating an array of memory cells that may be fabricated inaccordance with the techniques described herein;

FIGS. 2-9 illustrate a technique for fabricating an access device in amemory cell in accordance with the present invention;

FIG. 10 illustrates a cross-sectional view of the exemplary accessdevice illustrated in FIG. 9 further incorporating an exemplary storagedevice;

FIG. 11 illustrates a cross-sectional view of an alternate embodiment ofa bitline fabricated in accordance with the present techniques;

FIGS. 12 and 13 illustrate cross-sectional views of an alternateembodiment of a wordline fabricated in accordance with the presenttechniques;

FIGS. 14 and 15 illustrate cross-sectional views of another embodimentof a wordline fabricated in accordance with the present techniques;

FIGS. 16-18 illustrate an exemplary gate structure fabricated inaccordance with the present techniques;

FIG. 19 illustrates a circuit fabricated in accordance with the presenttechniques;

FIGS. 20-25 show a further fabrication method and structure according toan embodiment of the present invention.

FIG. 26 shows an electronic device in which the present invention may beused.

DETAILED DESCRIPTION OF THE EMBODIMENTS

In the following detailed description of the embodiments, reference ismade to the accompanying drawings which form a part hereof, and in whichis shown by way of illustration specific embodiments in which theinventions may be practiced. These embodiments are described insufficient detail to enable those skilled in the art to practice theinvention, and it is to be understood that other embodiments may beutilized and that process, electrical or mechanical changes may be madewithout departing from the scope of the present invention. The termswafer and substrate used in the following description include any basesemiconductor structure. Both are to be understood as includingsilicon-on-sapphire (SOS) technology, silicon-on-insulator (SOI)technology, thin film transistor (TFT) technology, doped and undopedsemiconductors, epitaxial layers of a silicon supported by a basesemiconductor structure, as well as other semiconductor structures wellknown to one skilled in the art. The following detailed description is,therefore, not to be taken in a limiting sense, and the scope of thepresent invention is defined only by the appended claims and theirequivalents.

The present description of the embodiments further make use of termssuch as horizontal, vertical, top, bottom, up, down and words of similarimport. These terms are meant to refer to orientation of the describedelement relative to a base substrate such as a wafer.

FIG. 1 is a partial schematic illustration of an integrated circuit,such as a memory device 10, incorporating an array of memory cells whichmay be fabricated in accordance with the techniques described herein.The memory device 10 may be, for example, a dynamic random access memory(DRAM) device. In an exemplary embodiment, the memory device 10 includesa number of memory cells 12 arranged in a grid pattern comprising anumber of rows and columns. As can be appreciated, the number of memorycells (and corresponding rows and columns) may vary depending on systemrequirements and fabrication technology.

Each memory cell 12 includes an access device and a storage device aspreviously discussed. In the present exemplary embodiment, the accessdevice comprises a field-effect transistor (FET) 14 and the storagedevice comprises a capacitor 16. The access device is implemented toprovide controlled access to the storage device. In the exemplary memorycell 12, the FET 14 includes a drain terminal 18 and a source terminal20, along with a gate terminal 22 for controlling conduction between thedrain and source terminals 18, 20. The storage device, such as thecapacitor 16, is coupled to one of the source/drain terminals 18, 20.The terminal of the capacitor 16 that is not coupled to the FET 14 maybe coupled to a reference plane.

It should be noted that although the above description depicts theterminal of the access device that is coupled to the capacitor 16 as thesource 20 and the other non-gate terminal of the access device as thedrain 18, during read and write operations, the FET 14 may be operatedsuch that each of the terminals 18 and 20 operates at one time oranother as a source or a drain. Accordingly, for purposes of furtherdiscussion, it should be recognized that whenever a terminal isidentified as a source or a drain, it is only for convenience as thesource and drain could be interchanged as understood in the art. Duringoperation of the FET 14 either terminal could be a source or a draindepending on the manner in which the FET 14 is being controlled by thevoltages applied to the terminals 18, 20 and 22 of the FET 14.

As previously described, the memory array is arranged in a series ofrows and columns. To implement the data storage capabilities in thememory cell 12, an electrical charge is placed on the drain 18 of theFET 14 via a bitline (BL). By controlling the voltage at the gate 22 viathe wordline (WL), a voltage potential may be created across the FET 14such that the electrical charge at the drain 18 can flow to thecapacitor 16. As can be appreciated, by storing an electrical charge inthe capacitor 16, the charge may be interpreted as a binary data valuein the memory cell 12. For instance, for a single-bit storage device, apositive charge above a known threshold voltage may be interpreted as abinary “1.” If the charge in the capacitor 16 is below the thresholdvalue, a binary value of “0” is said to be stored in the memory cell 12.

As previously described, the bitlines BL are used to read and write datato and from the memory cells 12. The wordlines WL are used to activatethe FET 14 to access a particular row of a memory cell 12. Accordingly,the memory device 10 includes an address buffer 24, row decoder 26, andcolumn decoder 28. As can be appreciated, the address buffer 24 controlseach of the row decoder 26 and the column decoder 28. The row decoder 26and column decoder 28 selectively access the memory cells 12 in responseto address signals that are provided on the address bus 29 during read,write, and refresh operations. The address signals are typicallyprovided by an external controller such as a microprocessor or othermemory controller. The column decoder 28 may also include senseamplifiers and input/output circuitry to further enable data to be readto and from the memory cell 12 via the bitlines BL.

In one exemplary mode of operation, the memory device 10 receives anaddress of a particular memory cell 12 at the address buffer 24. Theaddress buffer 24 identifies one of the wordlines WL of the particularmemory cell 12 corresponding to the requested address and passes theaddress to the row decoder 26. The row decoder 26 selectively activatesthe particular wordline WL to activate the FETs 14 of each memory cell12 that is connected to the selected wordline WL. The column decoder 28selects the bitline (or bitlines) BL of the memory cell 12 correspondingto the requested address. For a write operation, data received byinput/output circuitry is coupled to the selected bitline (or bitlines)BL and provides for the charge or discharge of the capacitor 16 of theselected memory cell 12 through the FET 14. The charge corresponds tobinary data, as previously described. For a read operation, data storedin the selected memory cell 12, represented by the charge stored in thecapacitor 16, is coupled to the selected bitline (or bitlines) BL,amplified by the sense amplifier, and a corresponding voltage level isprovided to the input/output circuit in the column decoder 28.

As can be appreciated, the memory array described with reference to FIG.1 of the memory device 10 may be fabricated through a variety oftechnologies. One particularly advantageous technique for fabricatingthe memory cells 12 will now be described with reference to FIGS. 2-10.The advantages of the presently described fabrication techniques willbecome apparent upon reading the following detailed description withreference FIGS. 2-10. To provide a high density memory device 10,vertical transistor technology wherein the channel of the FET 14 isfabricated perpendicular to the surface of a wafer rather than parallelto the surface, is implemented as further described below. In someapplications, vertical FETs are referred to as FINFETs. The term “FIN”is used herein to denote a semiconducting material which is employed asthe body of the FET. Advantageously, the vertically oriented access FET14 may occupy less area on the substrate than other, e.g., horizontal,FET structures. Further, by incorporating vertically oriented accessFETs 14, the memory cells 12 are less susceptible to alpha-radiation.Moreover, the channel is made thinner than horizontally planar channelssuch that essentially all of the channel is effected by the gate.

FIG. 2 illustrates an integrated circuit structure 30 that includes abase layer or substrate 31. In an embodiment, the substrate 31 iscrystal silicon. In an embodiment, the substrate 31 is a silicon oninsulator that may have other integrated circuit structures below orwithin the substrate 31. The other integrated circuit structures includeat least one of a conductor line, capacitors, transistors, and contactpads in an embodiment. An insulator layer 32 is fabricated on thesubstrate 31. In an embodiment, insulator layer 32 includes silicondioxide. A conductor layer 33 is fabricated on the insulator layer 32.Conductor layer 33 is patterned as an electrical signal line. In anembodiment, the conductor layer 33 forms buried digit lines (BL's) for amemory device. The conductor layer 33 is patterned by either an additiveor subtractive process. A subtractive process includes blanketdepositing a conductive material on insulator layer 32. Next, a radiantsensitive film, such as a wet film resist, or a dry film resist, isblanket deposited on the conductive material. The radiant sensitive filmis then exposed to a radiant source, e.g., a light source or laser, tothe pattern of conductor material. Development of the exposed radiantsensitive film forms a mask that can be used to etch the pattern ofconductor lines. In an embodiment, the material of the conductive layeris blanket deposited and then doped to be conductive only the pattern ofthe conductor layer 33. An “additive” process could also be used wherethe mask is patterned on the insulator and then conductive material isdeposited in the interstices in the mask. In an embodiment, theconductive material for the conductor layer is a doped polysilicon. Theconductive pattern of layer 33 consists of a conductive trace or lineconnected to a multitude of memory bit transistors for a multitude ofmemory cells in an array. Generally, either metal or silicided/polycidedpolysilicon forms the conductive line. In an embodiment layer 33includes a low resistance metal such as titanium or tungsten. In anembodiment layer 33 is tungsten silicide. Due to the large quantity ofattached memory bits, its physical length, and its proximity to otherfeatures, a digit line is capacitive. The capacitance of a digit linecontributes to signal delay in the memory array.

A further insulator layer 34 is formed over the conductive layer 33 andthe insulator layer 32. In an embodiment, insulator layer 34 includessilicon dioxide. Insulator layer 34 completely covers the patternedconductive layer 33 and the exposed portions of insulator layer 32.Layer 34 is formed to have a top planar surface in an embodiment. In anembodiment, the top surface of the of insulator layer 34 is planarized,for example by chemical mechanical planarization. In an embodiment, theinsulator layers 32 and 34 are thicker than the conductor layer 33. Inan embodiment, the insulator layers are thicker than the conductor layer33 by at least a factor of about 10. A recess 35 is formed through anassembly of insulator 34, conductor 33, and insulator 32 (FIG. 3).Substrate 31 closes the bottom end of recess 35. In an embodiment, therecess 35 is formed by selective etching. For example, a protective maskis patterned on the assembly of insulator 34, conductor 33, andinsulator 32 with the areas of the recesses 35 being uncovered by themask. The insulator 34, conductor 33, and insulator 32 that is notcovered by the mask are removed to expose the substrate layer 31.Recesses 35 define the footprint of the access devices, e.g., verticaltransistors for memory cells.

FIG. 4 illustrates the integrated circuit structure during subsequentfabrication. A mesa or body 36 for a vertical integrated circuitstructure is selectively formed in the recess 35. The body 36 extendsoutwardly from the substrate 31 and assembly of insulator 34, conductor33, and insulator 32. In an embodiment, body 36 has a height that isgreater than its cross sectional dimension (i.e., diameter or width).That is, the body is a vertically oriented integrated circuit structure.In an embodiment, the body 36 is formed by selective epitaxy. In anembodiment, the selective epitaxy is a silicon selective epitaxy thatgrows from a substrate 31 of silicon, i.e., homoepitaxy. A selectiveepitaxy process includes processes that grow a silicon, e.g.,polysilicon or crystalline silicon on only certain surface area. In thepresent invention, pillar or mesa bodies 36 of silicon are only grown inthe recesses 35. The selective epitaxy deposits an epitaxial layer onthe exposed substrate 31 in recesses 35. For example, a siliconepitaxial layer is formed in recesses 35 without growth of a siliconlayer on the exposed surface of insulator layer 34. This may beaccomplished at reduced partial pressure of a reactant so as to suppressnucleation of silicon on the insulator layer 34. In an embodiment,selective epitaxy is effected, for example, using a gas mixtureincluding H₂ and SiH₂Cl₂ in a temperature range between 600-800 degreesC. Such a gas mixture may have GeH₄ added to it in order to set thematerial composition of the seeds in applications of the presentinvention having germanium as part of the epitaxially grown layer. Thus,nucleation only occurs at the exposed surface of the substrate.Selective epitaxial layers are formed using a molecular beam epitaxy(gas source or solid source) in an embodiment. In an embodiment,selective epitaxial layers are deposited using chemical vapor depositionprocesses that are adapted for selective epitaxy. More specifically, theselective epitaxy mesa 36 is deposited by atoms produced by a gas phasereaction striking the substrate surface or the prior deposited selectiveepitaxy film. The atoms move around the surface until they are correctlyaligned and thus can bond to the exposed, previously formed siliconlayer. Potential gas sources for silicon epitaxy include a hydrogenreduction of silicon tetrachoride (SiCl₄), silane (SiH₄), dichlorosilane(SiH₂Cl₄ or DCS), trichlorosilane (TCS), or other hydrogen reducedchlorosilanes (SiH_(x)Cl_(4-x)).

During the fabrication of the mesa bodies 36, doped regions 37 areformed in contact with the conductor layer 33. In an embodiment, thedoped regions 37 are highly doped N+ regions. In an embodiment, thedopant includes at least one of phosphorous or arsenic. It will berecognized by one of skill that certain applications of the presentinvention may require P-type dopants such as boron. Doping of regions 37occurs during the selective epitaxy growth of mesa body 36. That is,regions 37 are doped in situ. Regions 37 are formed above the topsurface of substrate 31. The outer surface of regions 37 physicallycontact conductor layer 33. In an embodiment, regions 37 have a heightgenerally equal to the thickness of conductor layer 33. Regions 37extend around the periphery or circumference of mesa 36 in anembodiment. The regions 37 do not extend above conductor layer 37 so asto not contact insulator layer 34. In an embodiment, the doped regions37 are formed by ion implantation. In an embodiment doped regions 37 areformed by out diffusion from layer 33. Out diffusion occurs during hightemperature processing. The mesa 36 is further fabricated to extendabove the insulator layer 34. Doped region 38 is formed at the top ofthe mesa 36. Doped region 38 is formed using similar techniques asdescribed herein for doped regions 37. As a result of using selectiveepitaxy and doping at least one region 37 or 38 to form source/drains,the mesas 36 have a substantially continuous orientation of material.That is, there is no boundary between the doped and undoped regionsexcept for the doping material when doping during selective epitaxialgrowth of mesa 36.

FIG. 5 shows a simplified, cross sectional view of the integratedcircuit structure 30. The mesas 36 are circular in cross section. Thecircumference of mesas 36 are surrounded by annular doped regions 37.Doped regions 37 mechanically contact a respective circular portion ofconductive layer 33. In an embodiment, the conductive layer 33 is asignal line, for example, a bit line, for an integrated circuit device.

FIG. 6 shows integrated circuit structure 30 after a further fabricationstep. An insulating layer 42 is formed on the outer surface of mesa 36that extends above insulating layer 34. In an embodiment, the insulatinglayer 42 is a gate oxide material. A gate 44 is formed on the gate oxide42 (FIG. 7) to a height less than the height of the mesa 36. In anembodiment gate 44 is formed directly on the insulating layer 34. Thegate 44 is a conductive and controls operation of the structure 30 as atransistor. FIG. 8 shows a cross sectional view of the integratedcircuit structure 30 with the gates 44 extending annularly around thecylindrical insulating layer 42 and mesas 36. The gates 44 are connectedto signal lines, which are patterned conductive layers, that extend skewor perpendicular to the buried signal lines 33. After the gates 44 andconnected signal lines are formed, the interstices between the mesa 36,gate oxide 42, and gates 44 assemblies upstanding from insulating layer34 are filled with an insulator layer 46. The insulator layer 46provides mechanical strength to the assemblies and assists in preventingshorts between the assemblies. Insulator layer 46 is coplanar with thetop surface of mesa 36 in an embodiment (FIG. 9). In an embodimentinsulator layer 46 is initially formed covering the mesa 36 and removed,for example, by chemical-mechanical polishing, to be coplanar with thetop of mesa 36.

FIG. 10 shows the fabrication of vertical memory cell structure 49 onthe top surface of the transistor, integrated circuit structure 30. Asshown, a memory cell is a capactive structure that includes a bottomelectrode 50, a dielectric layer 52 on the bottom electrode 50, and atop electrode 54 on the dielectric layer 52. The dielectric layer 52electrically and physically separates the top and bottom electrodes suchthat one electrode, i.e., the bottom electrode 52, stores an electricalcharge to represent a positive value (“1”) or does not store a charge torepresent a zero value (“0”). The bottom electrode 50 is shown with aU-shape in cross section with the web thereof directly on the upperdoped region 38 of mesa 36. Dielectric layer 52 completely covers thetop surface of the bottom electrode 50 and any exposed top surface ofthe insulator layer 46 so as to electrically isolate adjacent memorycells. Top electrode 54 is deposited on the dielectric layer 52 in acontinuous manner so as to completely cover the dielectric layer 52. Thetop electrode 54, in the illustrated embodiment, is shared by aplurality of individual memory cells.

FIG. 11 shows a further embodiment of the present invention. Morespecifically, FIG. 11 shows a cross-sectional top view of an alternateembodiment of the structure illustrated with reference to FIG. 4 andtaken along cut lines 5-5. As can be seen, the doped regions 37A(reference numbers are the same as in the prior figures but with thesuffix A added) is patterned to provide semi-annular rings around themesas 36. Elements that are essentially the same as those describedabove are labeled with the same reference numbers. Elements that differfrom those described above are labeled with the same reference numberwith the suffix “A.” Thus, the doped region 37A, which in an embodimentforms the bitlines of the memory array described with reference to FIG.1, extends to connect each of the mesas 36 in a single column. Thus, thepresent embodiment includes a doped polysilicon region 37A which ispatterned to only partly extend around of the mesa 36. Advantageously,the FIG. 11 embodiment may provide for further pitch reduction and thus,reduction in the area of each memory cell and overall die size.

Similarly, the wordline WL, may be patterned to provide a semi-annularring only partly around the selective epitaxy mesa 36. FIGS. 12 and 13show an embodiment of the wordline WL, incorporating semi-annular rings.FIG. 12 shows a structure similar to the structure depicted in FIG. 7.Here, after deposition of insulator layer 34 and the growth of the gateoxide layer 42, a polysilicon layer is deposited, patterned and etchedto form the polysilicon layer 44A having semi-annular rings. As can beappreciated, the wordline polysilicon layer 44A extends in a directionperpendicular to the page with reference to FIG. 12. Thus, the view ofthe structure illustrated in FIG. 12 includes the polysilicon layer 44Aon only one side of the mesa 36. The wordline polysilicon layer 44A ispatterned about a portion of the outer surface of the mesa 36 as shownin FIG. 13.

FIG. 13 shows a cross-sectional top view of the FIG. 12 embodiment takenalong cut lines 13-13. Wordline polysilicon layer 44A is patterned toprovide semi-annular rings around and in direct contact with mesa 36intermediate the doped regions 37 and 38. The wordline polysilicon layer44A is patterned such that it runs perpendicular to the bitlinepolysilicon layer 33A. While FIGS. 11-13 illustrate semi-annular rings,it should be evident that an annular ring may extend around anydesirable portion (e.g. more than half or less than half) of the mesa36. For instance, it may be advantageous to provide partially annularrings that extend around only a quarter to a third of the circumferenceof the mesa 36. Alternatively, it may be advantageous to providepartially annular rings that extend around two-thirds to three-quartersof the circumference of mesa 36.

FIG. 14 shows an alternate embodiment of the structure illustrated inFIG. 9, implementing an alternate technique of fabricating the wordlineWL. FIG. 15 illustrates a cross-sectional top view of the alternateembodiment illustrated in FIG. 14 and taken along the cut lines 15-15.In the present exemplary embodiment, the wordline polysilicon layer 44is replaced with a thin gate conductor layer 44B and a thick signalconductor layer 44C. As can be seen, the thin gate conductor layer 44Bcompletely surrounds the selective epitaxy mesa 36. The thin gateconductor layer 44B may have a thickness extending from the surface ofmesa 36 of less than 0.1 microns. After deposition, patterning andetching of the thin conductor layer 44B, an insulator layer 46A isdisposed. Unlike an embodiment described above, however, the insulatorlayer 46A is not disposed to cover the entire mesa 36. Insulator layer46A is disposed such that a portion of the mesa 36 remains uncovered, asillustrated in FIG. 14. Next, the thick signal conductor layer 44C isdisposed, patterned and etched form the wordline WL. The gate conductorlayer 44B is electrically coupled to the signal conductor layer 44C. Inone exemplary embodiment, the gate conductor layer 44B and the signalconductor layer 44C are each polysilicon layers. However, as can beappreciated, the gate conductor layer 44B and the signal conductor layer44C may be different conductive materials. For instance, the gateconductor layer 44B may be a polysilicon layer, while the signalconductor layer 44C may be a tungsten layer. To complete the structure,a, dielectric layer 46B may be disposed to a thickness sufficient tocover the mesas 36, and the suface of the structure may be planarized,as previously described. Advantageously, by providing a thin gateconductor layer 44B coupled to a thick signal conductor layer 44C, asmaller pitch between structures may be implemented, thereby reducingcell size and overall die size.

As can be appreciated, while the present wordline and bitline structuresare described as being fabricated through deposition techniques, otherprocesses, such as a damascene process may implemented to form thewordlines and bitlines in accordance with the present techniques.Further, while the present exemplary embodiments have illustrated theannular gate structures with respect to DRAM memory devices, the presenttechniques may be implemented in a number of other applications,including but not limited to flash memory cells, SRAM memory cells,anti-fuse devices, image sensors and simple logic gates.

FIG. 16 shows a schematic diagram of simple logical gate structure 60that may be fabricated in accordance with the present techniques. FIG.17 shows an exemplary structure that forms part of the logical gatestructure 60 illustrated in FIG. 16. The gate structure 60 of FIG. 16includes a first transistor 62 coupled in parallel with a secondtransistor 64. Each transistor 62 and 64 has a respective gate terminal66 and 68. The source terminals of each transistor 62 and 64 are coupledto each other at a common node 70 such that they may be tied to a commonreference SIGNAL1. The drain terminals of each transistor 62 and 64 arecoupled to each other at a common node 72, such that they can be tied toa common reference SIGNAL2.

FIG. 17 partially shows the fabrication of the gate structure 60, inaccordance with the techniques previously described herein. Thedeposition techniques, exemplary materials and deposition thicknessesdescribed above may be used to supplement the description of the presentexemplary embodiment. For clarity, like reference numerals with an addedsuffix have been used to illustrate layers previously described.Accordingly, the gate structure 60 includes a substrate 31A, such as ap-doped silicon, having a selective epitaxy, silicon mesa 36A. Aninsulation layer, such as an oxide layer 32A, is disposed over thesubstrate 31A. A conductive layer, such as a polysilicon layer 33B, isdisposed over the oxide layer 32A. The polysilicon layer 33B may bepatterned to form annular rings around the mesa 36A or partial annularrings, such as semi-annular rings. The polysilicon layer 33B forms asignal path. In this embodiment, the polysilicon layer 33B may beimplemented to provide the common reference SIGNAL2 that is coupled tothe common node 72 of the gate structure 60 (as shown in FIG. 16). Asecond insulation layer, such as an oxide layer 34A is disposed over thepolysilicon layer 33B. Further, n+ contact regions 37A are formed nearthe base of mesa 36A. The top of mesa 36A may include a contact region38A which may be electrically coupled to a SIGNAL 1 at the common node70 of the gate structure 60. A gate oxide layer 42A is disposed or grownabout the external surface of mesa 36A. Because the gate structure 60includes two gates 66 and 68, two isolated conductive layers such aspolysilicon layers 44D and 44E are disposed. The polysilicon layers 44Dand 44E are electrically isolated with respect to each other and formthe gates 66 and 68 of the structure 60. As with the polysiliconwordline 44 described above, the polysilicon layers 44D and 44E extendin a direction perpendicular to the page in FIG. 17. Each polysiliconlayer 44D and 44E may be patterned to form a partial annular ring aboutthe mesa 36A. To provide electrical isolation of the polysilicon layers44D and 44E, each of the partial annular rings may extend aroundapproximately one-third of the circumference of mesa 36A. FIG. 18illustrates a cross-sectional top view of the structure illustrated withreference to FIG. 17 and taken along cut lines 18-18 after deposition ofthe insulator (dielectric) layer 46A. Alternately, the polysiliconlayers 44D and 44E may be electrically isolated by disposing thepolysilicon layers 44D and 44E in different planes along the length ofthe pillar 33A, as can be appreciated by those skilled in the art.

FIG. 19 shows a schematic diagram of another logical gate structure 74,which is fabricated according to the teachings of the presenttechniques. That is, gate 74 includes at least one vertical integratedcircuit device fabricated according to the techniques described herein.The gate structure 74 of FIG. 19 includes a first transistor 76 coupledin parallel with a second transistor 78. Each transistor 76 and 78 has arespective gate terminal 80 and 82. The source terminals of eachtransistor 76 and 78 are coupled to each other at a common node 84 suchthat they may be tied to a common reference SIGNAL1. The drain terminalsof each transistor 76 and 78 are coupled to each other at a common node86. The common node 86 is coupled to the source terminal of a thirdtransistor 88. The third transistor 88 has a respective gate terminal90. The drain terminal 92 of the third transistor 88 is coupled to acommon reference SIGNAL2.

FIGS. 20-25 show a further embodiment of the present invention.Integrated circuit structures 30A shown in FIGS. 20-25 and include asubstrate 31, insulative layer 32, conductor layer 33, insulative layer34 and recess 35 as described above. A mesa or pillar 36A is grown inthe recess 35 using selective epitaxy. A portion 37A of the mesa 36A isdoped to form a conductive contact to conductive layer 33. The contact37A extends throughout the region of the mesa 36A that is verticallyaligned with the conductive layer 33 such that the top and bottomsurfaces of both the conductive layer 33 and contact portion 37A areessentially coplanar. In an embodiment, the top and bottom surfaces ofthe contact portion 37A are not in the same plane of the conductivelayer 33 such that the dimension of the contact portion 37A is less thanthe dimension (e.g., height) of the conductive layer. The contactportion 37A is shown with N+ doping, however, it will be recognized thatother embodiments have different doping depending on the application andthe materials used to form the structure. The mesa 36A does not have thetop contact portion at this time.

Next, a series of layers are formed over the entire substrate, which inan embodiment is a wafer (FIG. 21). The first layer 101 is an oxidelayer formed from a material that is suitable for a gate oxide. Thefirst layer is formed directly over the upper insulating layer 34 andcompletely covers the mesa 36A. The second layer 102 is formed directlyon the first layer. In an embodiment the second layer is a polysiliconlayer. The polysilicon, second layer 102 is adapted to form a gate. Athird layer 104 is formed over the second layer 102. In an embodimentthe third layer is a conductor. In an embodiment, the third layerincludes a metal. In an embodiment, the metal third layer includestungsten. In an embodiment, the metal third layer is a metal alloy. Inan embodiment, the third layer includes tungsten nitride. The thirdlayer 104 is patterned to form a signal line or interconnet, e.g., aword line. A fourth layer 106 is formed over the third layer 104. Thefourth layer 106 is an insulating layer. In an embodiment the fourthlayer is silicon nitride (Si₃N₄). Other non-conducting materials couldbe used for the insulating, fourth layer 106.

FIG. 22 shows the next step in fabricating the integrated circuitstructure 30A. The areas intermediate the mesas 36A are etched to removethe excess portions of layers 101, 102, 104, and 106. This etchingprocess is done to remove horizontal portions of all four layers 101,102, 104, and 106 down to the insulating layer 34. The horizontalportions of the four layers 101, 102, 104, and 106, which are on top ofthe mesas 36A, are removed. These top portions of the four layers 101,102, 104, and 106 are removed by chemical-mechanical planarization orpolishing down to at least the tops surface of the mesas 36A.Accordingly, the mesas 36A and the remaining vertical portions fourlayers 101, 102, 104, and 106 have a coplanar top surface. FIG. 23 showsthe areas intermediate the mesas 36A and the remaining vertical portionsfour layers 101, 102, 104, and 106 are filled with a non-conductivematerial 112. In an embodiment, the intermediate areas are filled with aglass. In an embodiment, the intermediate areas are filled with aninsulative oxide. Non-conductive material 112 fills the intermediateareas prior to removing the layers in an embodiment. After the fourlayers 101, 102, 104, and 106 are partly removed and the insulatinglayer 34 intermediate the mesas 36A and remaining portion of the fourlayers are covered by the non-conductive material 112, the only areawhereat silicon is upwardly exposed is the top surface of each mesa 36A.The top contact 108 is now grown using selective epitaxy (FIG. 23).Preferably, the top contact 108 is doped in situ while it is deposited.The top contact 108 extends above the top surfaces of the four layers101, 102, 103, and 104. In an embodiment, top contact is formed by outdiffusion of a dopant from a layer overlying contact 108. Such a layercontaining the dopant is subsequently removed.

FIGS. 24 and 25 show further steps in fabricating capacitive memorycells on the transistors formed by mesas 36A and the four layers. In anembodiment the capacitive memory cell 120 is a container type. Next aninsulating layer 118 is formed on the top surface of the top contact108, four layers 101, 102, 104, and 106, and the non-conductive materiallayer 112. In an embodiment this insulating layer 118 includes a glass.In an embodiment, layer 118 includes an insulative oxide material. Arecess is formed in the layer 188 and provides a container for thecapacitor. A bottom capacitive layer 122 is formed in the recess on thewalls of the insulative layer 118 and on the top contact 108. Adielectric layer 124 is formed on the bottom capacitive layer 122. A topcapacitive layer 126 is formed on the dielectric layer 124, whichcompletely separates the layers 122 and 126.

The mesa 36, 36A described herein is adapted for use as a conductorbetween levels in an integrated circuit. It is recognized that the mesa36, 36A could form a conductive signal line between levels in additionto forming a transistor as described above. Specifically, the mesa 36,36A is described as a transistor body with doped source\drain regions37, 38 and a channel region intermediate the source\drain regions. In anembodiment the mesa is doped such that it is always conductive betweento conductive layers instead of being a switch device.

The integrated circuit structures described herein are fabricatedaccording to integrated circuit fabrication techniques such as selectiveepitaxy, chemical vapor deposition, physical vapor deposition, and othertechniques understood by one of skill in the art. Moreover, thestructures described herein are adapted to be used as components in avariety of electronic devices, such as memory modules, circuit modules,electronic systems, and computer systems. As shown in FIG. 26, two ormore dies, typically packaged, 201 of the present invention may becombined, with or without protective casing, into a circuit module 200to enhance or extend the functionality of an individual die 201. Atleast one die 201 includes a memory cell, vertical transistor, orinterlevel signal line formed according to the present invention.Circuit module 200 may include combination of dice 201 representing avariety of functions, or a combination of dice 201 containing the samefunctionality. In an embodiment, circuit module 200 includes at leastone socket, slot, recess, mounting site or the like into which the die201 is received. Some examples of a circuit module include memorymodules, device drivers, power modules, communication modems, processormodules and application-specific modules, and may include multilayer,multichip modules. Such modules will have a chip receiver in which achip according to the present invention is inserted. Circuit module 200may be a subcomponent of a variety of electronic systems, such as aclock, a television, a cell phone, a personal computer, an automobile,an industrial control system, an aircraft and others. Such modules willhave a circuit module receiver in which a circuit module according tothe present invention is inserted. Circuit module 200 will have avariety of leads 205 ₁ through 205 _(N) extending therefrom. The leads205 ₁ through 205 _(N) are adapted to connect the circuit module toother electrical circuits to provide an interface for unilateral orbilateral communication and control. Some examples of an interface thatis a user interface include the keyboard, pointing device, monitor orprinter of a personal computer; the tuning dial, display or speakers ofa radio; the ignition switch, gauges or gas pedal of an automobile; andthe card reader, keypad, display or currency dispenser of an automatedteller machine. A user interface may further describe access portsprovided to an electronic system. Access ports are used to connect anelectronic system to the more tangible user interface componentspreviously exemplified. One or more of the circuit modules may be aprocessor providing some form of manipulation, control or direction ofinputs from or outputs to a user interface, or of other informationeither preprogrammed into, or otherwise provided to, an electronicsystem. As will be apparent from the lists of examples previously given,an electronic system will often be associated with certain mechanicalcomponents (not shown) in addition to a circuit modules and an userinterface. It will be appreciated that one or more circuit modules in anelectronic system can be replaced by a single integrated circuit.Furthermore, an electronic system may be a subcomponent of a largerelectronic system.

CONCLUSION

The present disclosure describes a method for fabricating a verticaltransistor and a vertical memory cell. Vertical structures extendoutwardly from the planar surface of a substrate, i.e., upwardly from atop surface of a wafer. Such vertical structures use less real estate(area) on a substrate than convention planar (horizontal) transistorsand memory cells. There is a constant desire in the field of integratedcircuits to pack more devices and structures on a substrate or die.There is also a further desire to fabricate smaller dies that have atleast the same functionality as prior larger dies. The present inventionaddresses these desires. Moreover, there is a constant desire to reducefabrication complexity to achieve fewer defects caused by complexfabrication techniques and to increase fabrication throughput. Forexample, the present invention may not require shallow trench isolationbetween devices thereby freeing more area on the substrate for activedevice fabrication.

Although specific embodiments have been illustrated and describedherein, it will be appreciated by those of ordinary skill in the artthat any arrangement which is calculated to achieve the same purpose maybe substituted for the specific embodiments shown. Many adaptations ofthe invention will be apparent to those of ordinary skill in the art.For example, other integrated circuit processing equipment may beutilized in conjunction with the invention. For another example, otherintegrated circuit fabrication processes are adapted to produce the diesand chips according to the present invention. Accordingly, thisapplication is intended to cover any adaptations or variations of theinvention. It is manifestly intended that this invention be limited onlyby the following claims and equivalents thereof.

1. A method of fabricating an integrated circuit device, comprising:patterning a buried conductor line on a substrate; forming recessthrough the buried conductor line to the substrate; forming, throughselective epitaxy, a vertical mesa in the recess; doping a firstsource/drain region in electrical communication with the buriedconductor while forming the mesa; forming a gate oxide on the mesa;forming a gate on the gate oxide at least partially surrounding themesa; and forming a second source/drain region at a top of the mesaremote from the substrate.
 2. The method of claim 1, wherein doping afirst source/drain region includes forming an ohmic contact with theburied layer, which forms a buried bit line.
 3. The method of claim 2,wherein doping a first source/drain region includes forming the firstsource/drain region at a vertical dimension about equal or less than theburied bit line.
 4. The method of claim 1, wherein forming a secondsource/drain region includes further selective epitaxially growing adoped region on the mesa.
 5. The method of claim 1, wherein forming asecond source/drain region includes further selective epitaxiallygrowing a region on the mesa and thereafter doping the region.
 6. Themethod of claim 5, wherein doping the region includes thermally drivinga dopant into the region.
 7. The method of claim 1, wherein doping, byout-diffusion, the first source/drain region includes forming the firstsource/drain region around the outer periphery of the mesa.
 8. Themethod of claim 1, wherein doping a first source/drain region includesdoping a region of the mesa to a height generally equal to a height ofthe buried conductor line.
 9. The method of claim 8, wherein doping afirst source/drain region includes completely enclosing the firstsource/drain region with the buried conductor line.
 10. The method ofclaim 8, wherein forming recess through the buried conductor line to thesubstrate includes forming the recess through an insulative layer on theburied conductor line.
 11. The method of claim 10, wherein formingrecess through the buried conductor line to the substrate includesforming the recess through a further insulative layer intermediate theburied conductor line and the substrate.
 12. The method of claim 1,wherein forming, through selective epitaxy, a vertical mesa includesusing chemical vapor deposition processes that are adapted for selectiveepitaxy.
 13. A method of fabricating an integrated circuit device,comprising: patterning a buried conductor line on a substrate; formingrecess through the buried conductor line to the substrate; forming,through selective epitaxy, a vertical mesa in the recess; doping a firstsource/drain region in electrical communication with the buriedconductor while forming the mesa; forming a gate oxide on the mesa;forming a gate on the gate oxide at least partially surrounding themesa; and doping, while forming the mesa, a second source/drain regionat a top of the mesa remote from the substrate.
 14. The method of claim13, wherein patterning the buried conductor includes connecting theburied conductor line to a memory decoder for a memory device.
 15. Themethod of claim 13, wherein doping a first source/drain region includesdoping the mesa with N type dopants.
 16. The method of claim 13, whereinforming, through selective epitaxy, a vertical mesa includes performinghomoepitaxy of silicon.
 17. The method of claim 14, wherein performinghomoepitaxy of silicon includes exposing a silicon surface to a gasmixture including H₂ and SiH₂Cl₂ in a temperature range between 600-800degrees C.
 18. The method of claim 13, wherein forming, throughselective epitaxy, a vertical mesa includes exposing the recess to a gasmixture having GeH₄.
 19. The method of claim 13, wherein forming,through selective epitaxy, a vertical mesa includes using a molecularbeam epitaxy.
 20. The method of claim 19, wherein using a molecular beamepitaxy includes using a gas source.
 21. The method of claim 13, whereinforming, through selective epitaxy, a vertical mesa includes depositingsilicon atoms produced by a gas phase reaction striking one of a siliconsubstrate surface or a previously deposited selective epitaxy film. 22.The method of claim 21, wherein depositing silicon atoms includesproviding at least one of silicon tetrachoride (SiCl₄), silane (SiH₄),dichlorosilane (SiH₂Cl₄ or DCS), trichlorosilane (TCS), or otherhydrogen reduced chlorosilanes (SiH_(x)Cl_(4-x)).
 23. The method ofclaim 13, wherein forming the mesa includes forming a body that has aheight greater than a cross sectional dimension.
 24. A method forfabricating an integrated circuit device including a transistor,comprising: patterning a buried conductor line on a substrate; formingrecess through the buried conductor line to the substrate; forming,through selective epitaxy, a vertical mesa in the recess; doping a firstsource/drain region in electrical communication with the buriedconductor while forming the mesa; forming a second source/drain regionat a top of the mesa remote from the substrate; forming a gate oxidelayer on the substrate and the mesa; forming a gate layer on the gateoxide at least partially surrounding the mesa; forming an insulativelayer on the gate layer; and planarizing the gate oxide layer, the gatelayer and the insulative layer off the top of the mesa.
 25. The methodof claim 24, wherein forming a second source/drain region is performedafter planarizing.
 26. The method of claim 25, wherein forming aninsulative layer includes filling the gaps between the vertical mesasand insulative layers with a further insulative material.
 27. The methodof claim 24, wherein patterning a buried conductor line includes forminga first insulative layer on the substrate, masking the insulative layer,patterning the buried conductive layer using the masking; and coveringthe patterned buried conductive layer with a second insulative layer.28. The method of claim 27, wherein forming the recess includes formingthe recess through the first insulative layer, the buried conductivelayer, and the second conductive layer to reach the substrate.
 29. Amethod for fabricating an integrated circuit device including a memorycell, comprising: patterning a buried conductor line on a substrate;forming recess through the buried conductor line to the substrate;forming, through selective epitaxy, a vertical mesa in the recess;doping a first source/drain region in electrical communication with theburied conductor while forming the mesa; forming a second source/drainregion at a top of the mesa remote from the substrate; forming a gateoxide layer on the substrate and the mesa; forming a gate layer on thegate oxide at least partially surrounding the mesa; forming aninsulative layer on the gate layer; planarizing the gate oxide layer,the gate layer and the insulative layer off the top of the mesa; andforming a memory structure on the second source/drain region.
 30. Themethod of claim 29, wherein forming the gate layer includes extendingthe gate layer completely around the periphery of a portion of the mesa.